CPU Socket 2011 CPU Support Intelî Sandy Bridge EP/EX Processors up to 150 Watts Solution 2U Up Server Overall Dimension 91.5 x 91.5 x 66.0 mm Weight 59 0 g Material H.C.C.(Heatpipes Contact CPU) Copper Base Alumin...
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CPU Socket 2011 CPU Support Intelî Sandy Bridge EP/EX Processors up to 150 Watts Solution 2U Up Server Overall Dimension 91.5 x 91.5 x 66.0 mm Weight 59 0 g Material H.C.C.(Heatpipes Contact CPU) Copper Base Alumin...
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CPU Socket 2011 CPU Support Intelî Sandy Bridge Romley-EP/EX Narrow ILM Processors up to TDP 150 Watts Solution 2U Solution Overall Dimension 102.0 x 70.0 x 67.0 mm Weight 660 g Material Copper Heatsink with Stacke...
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CPU Socket 2011 CPU Support Intelî Sandy Bridge Romley-EP/EX Narrow ILM Processors up to TDP 95 Watts Solution 1U Server Overall Dimension 106.0 x 70.0 x 25.5 mm Weight 550 g Material Copper Heatsink Fan Dimension ...
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HP Mini 210The new HP Mini 210 gives you high-quality entertainment and high productivity, a combo that rocks when you're on the go. Built-in Beats Audio sets a new standard for music listening and cinematic sound in ...
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StarTech.com silver thermal transfer compound improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. StarTech.com chose this substance to put into the heat-grease because silver is one...
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Features: Intel Core i7-2670QM processor Genuine Windows 7 Home Premium (64-bit), SP1 6GB DDR3 1333MHz memory Intel Integrated Graphics 750GB HDD (5400rpm) Blu-ray Disc ROM and DVD SuperMulti drive with Labelflash In...
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Specifications. Mfr Part Number: DF124010BM3G. Features: . Frame: Plastic Material UL 94V0. Blade: Plastic Material UL 94V0. Dielectric Strenth: 50/60 Hz 500 VAC 1 minute (between lead conductor and frame). Insulation...
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Specifications. Mfr Part Number: DF126010PM3G. Material: Plastic Material UL 94V0. Dielectric Strenth: 50/60 Hz 500 VAC 1 minute (between lead conductor and frame). Insulation Resistance: 50M ohm min. at 500 VDC (betw...
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